RCDD · Question #120
Often associated with raised flooring, a(n) ________ may consist of copper straps taped to the concrete floor, or it may be the floor itself with the stringers that support the tiles acting as the…
The correct answer is C. Signal reference grid (SRG). A signal reference grid (SRG) is a low-impedance equipotential bonding system used under raised flooring, constructed from copper straps, copper tape, or the conductive raised-floor structure itself to reduce noise and interference for sensitive equipment.
Question
Often associated with raised flooring, a(n) ________ may consist of copper straps taped to the concrete floor, or it may be the floor itself with the stringers that support the tiles acting as the bonding conductor across the gradient of the floor.
Options
- AGrounding electrode conductor (GEC)
- BElectrical ground bar (EGB)
- CSignal reference grid (SRG)
- DTelecommunications bonding backbone (TBB)
- EDrain wire
How the community answered
(16 responses)- A6% (1)
- B19% (3)
- C69% (11)
- D6% (1)
Why each option
A signal reference grid (SRG) is a low-impedance equipotential bonding system used under raised flooring, constructed from copper straps, copper tape, or the conductive raised-floor structure itself to reduce noise and interference for sensitive equipment.
The grounding electrode conductor (GEC) is the conductor that connects the electrical service equipment to the grounding electrode buried in the earth, and is not associated with under-floor bonding grids.
An electrical ground bar (EGB) is a bus bar used in electrical panels or equipment rooms to consolidate equipment ground connections, not a raised-floor mesh bonding structure.
The signal reference grid (SRG) is specifically designed for data center and equipment room environments with raised flooring, where it creates a mesh equipotential bonding plane beneath the floor tiles. It can be implemented using copper straps or tape bonded to the concrete subfloor, or by using the raised floor's metal stringers and pedestals as the bonding conductors across the floor gradient. As defined in ANSI/TIA-607, its purpose is to reduce common-mode noise, ESD potential differences, and interference affecting telecommunications and IT equipment above.
The telecommunications bonding backbone (TBB) is a vertical riser conductor that interconnects telecommunications grounding busbars (TMGBs) throughout a multi-story building, not a floor-level reference grid.
A drain wire is the bare conductor inside a shielded or screened cable used to terminate the cable shield at a connector or equipment chassis, not a raised-floor bonding system.
Concept tested: Signal reference grid design and function under raised flooring
Source: https://tiaonline.org/standard/tia-607-d/
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