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RCDD · Question #238

You are designing a DAS that will support five buildings on a college campus. Which medium is best suited to ensure the best connectivity and throughput between the headend and backend devices…

The correct answer is B. Optical fiber cabling. Optical fiber is the optimal inter-building medium for a campus DAS due to its high bandwidth, long reach, and immunity to electromagnetic interference.

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Question

You are designing a DAS that will support five buildings on a college campus. Which medium is best suited to ensure the best connectivity and throughput between the headend and backend devices located in the various buildings?

Options

  • ACoaxial
  • BOptical fiber cabling
  • CShielded twisted pair cabling
  • DUnshielded twisted pair cabling

How the community answered

(51 responses)
  • A
    4% (2)
  • B
    73% (37)
  • C
    16% (8)
  • D
    8% (4)

Why each option

Optical fiber is the optimal inter-building medium for a campus DAS due to its high bandwidth, long reach, and immunity to electromagnetic interference.

ACoaxial

Coaxial cable suffers significant signal attenuation over the longer inter-building distances of a campus environment and remains susceptible to ground loops between separate structures.

BOptical fiber cablingCorrect

Optical fiber supports very high throughput over long distances without signal degradation from EMI or ground-loop issues that affect copper media, which is critical when linking a DAS headend to remote units across multiple campus buildings. It also provides electrical isolation between structures, preventing ground potential differences and lightning-induced damage that are common failure modes in multi-building copper installations.

CShielded twisted pair cabling

Shielded twisted-pair cabling has a maximum run length of approximately 100 m for standard Ethernet, making it impractical for inter-building campus links without adding repeaters.

DUnshielded twisted pair cabling

Unshielded twisted-pair cabling shares the 100 m distance limitation of STP and is more susceptible to EMI, making it the least suitable option for a campus-scale DAS backbone.

Concept tested: DAS backbone medium selection for multi-building campus

Source: https://www.cisco.com/c/en/us/td/docs/solutions/Enterprise/Campus/campover.html

Topics

#DAS#campus network#optical fiber#headend connectivity

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