220-801 · Question #911
Thermal paste is used with which of the following components?
The correct answer is B. Heat sink. Thermal paste (also called thermal compound or thermal interface material) is applied between the CPU (or GPU) and the heat sink. Its purpose is to fill microscopic air gaps and imperfections on the mating surfaces, which would otherwise act as thermal insulators and reduce…
Question
Thermal paste is used with which of the following components?
Options
- AFan
- BHeat sink
- CMotherboard
- DRAM
How the community answered
(16 responses)- A6% (1)
- B94% (15)
Explanation
Thermal paste (also called thermal compound or thermal interface material) is applied between the CPU (or GPU) and the heat sink. Its purpose is to fill microscopic air gaps and imperfections on the mating surfaces, which would otherwise act as thermal insulators and reduce heat transfer efficiency. The heat sink (B) sits directly on top of the processor and draws heat away from it - the thermal paste maximizes this contact. The fan (A) is typically mounted on top of the heat sink to move air over its fins, but thermal paste is not applied to the fan itself. Thermal paste is never applied to the motherboard (C) or RAM (D).
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