220-801 Question #660: Real Exam Question with Answer & Explanation

The correct answer is B: aid in the transfer of energy from the CPU to the heatsink.. Thermal paste (also called thermal compound or thermal interface material) is applied between the CPU and heatsink to fill microscopic air gaps caused by imperfect surface contact. Air is a poor thermal conductor, so these gaps would trap heat. Thermal paste, being highly thermal

Question

Thermal paste is used between the CPU and heatsink to:

Options

Amake the heatsink easier to remove when replacing the CPU.
Baid in the transfer of energy from the CPU to the heatsink.
Cact as a fire retardant should the CPU overheat.
Dkeep the heatsink in place on the CPU.

Explanation

Thermal paste (also called thermal compound or thermal interface material) is applied between the CPU and heatsink to fill microscopic air gaps caused by imperfect surface contact. Air is a poor thermal conductor, so these gaps would trap heat. Thermal paste, being highly thermally conductive, bridges those gaps and maximizes heat transfer from the CPU to the heatsink. It does not act as adhesive (D), a fire retardant (C), or a lubricant for removal (A).

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