CompTIA
220-801 · Question #611
220-801 Question #611: Real Exam Question with Answer & Explanation
The correct answer is A: Thermal paste. Thermal paste is the first material in the heat transfer chain, sitting directly between the processor and the heatsink to maximize thermal contact.
Question
Which of the following is the FIRST component to transfer heat away from a processor?
Options
- AThermal paste
- BCase fan
- CLiquid cooling
- DHeatsink
Explanation
Thermal paste is the first material in the heat transfer chain, sitting directly between the processor and the heatsink to maximize thermal contact.
Common mistakes.
- B. A case fan moves air through the chassis to exhaust heat already dissipated by the heatsink or radiator, so it acts later in the cooling chain.
- C. Liquid cooling (water block, pump, radiator) carries heat away after it has already passed through the thermal interface material into the cold plate.
- D. The heatsink absorbs and spreads heat from the processor, but only after the thermal paste has bridged the two surfaces - making it the second component, not the first.
Concept tested. Processor cooling heat transfer order
Reference. https://www.intel.com/content/www/us/en/gaming/resources/thermal-paste.html
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